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High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

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High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

Name: High Thermal Conductivity 65WMK Thermal GAP PAD Materials For Computer CPUGPU Cooling
Brand: Ziitek
Price: 0.1 USD

Wholesale High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling from china suppliers

Brand Name : Ziitek

Model Number : TIF500-65-11U

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

Sample : Sample free

Breakdown Voltage（V/mm） : ≥5500

Thickness range : 0.010"~0.200"(0.25mm~5.0mm)

Application : Computer CPU/GPU Cooling

Fire rating : 94 V0

Color : Dark Gray

Thermal conductivity : 6.5W/m-K

Dielectric Constant @ 1MHz : 7.0MHz

Keywords : Thermal Gap Pad

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High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF^®500-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> High thermal conductivity
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.

> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)

> Photovoltaic
> Signal communication
> New energy vehicle

> Motherboard chip
> Radiator
> AI Processors AI Servers

Typical Properties of TIF^®500-65-11U Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.4		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	27 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥ 5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	6.5		ASTM D5470
	6.5		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling Images

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