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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

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Brand Name : Ziitek

Model Number : TIS812-11-03

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/pcs

Supply Ability : 1000000 pcs/month

Delivery Time : 3-6 work days

Packaging Details : 24*13*12cm cartons

Product name : Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

Thickness range(inch/mm) : 0.012/0.305

Color : Yellow

Materials : Ceramic filled silicone elastomer / Polyimide film

Feature : Low thermal resistant with high voltage isolation

Thermal conductive : 1.2W/mK

continous use temp : -60 to 180℃

compliance : UL & RoHS

Application : GPU Cpu Battery

keyword : Thermal Silicone Insulation Pad

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Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

The TIS®812-11-03 Series of products are highly efficient insulating products and they also have thermal conductivity. It achieves the effect of both insulation and heat conduction by adding insulating silicone base material to the heat-conducting material.


Features:
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures

> Easy release construction
> Electrically isolating
> High durability


Applications:
> Car Battery & Power Supply

> Power semiconductors
> Audio and Video components

> Motor controllers

> Heat pipe thermal solutions
> Memory Modules
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TIS®812-11-03 Series
Property Value Test Method
Color Yellow Visual
Construction &Compostion Ceramic filled silicone elastomer /Polyimide film ******
Thickness range

0.012inch (0.305mm)

ASTM D374
Tensile Strength(MPa) 1.5 ASTM D412
Density 2.4 g/cc ASTM D297
Continuos Use Temp -60 to 180℃ ******
Breakdown Voltage(V/mm) 5000 ASTM D149
Dielectric Constant @ 1MHz

5.0

ASTM D150
Volume Resistivity 1.0X1012 Ohm-meter ASTM D257
Fire rating 94 V0 UL94(E331100)
Thermal conductivity 1.1W/m-K ASTM D5470
Thermal impedance(℃-in²/W)@30psi 0.61 ASTM D5470

Standard Thicknesses

0.012inch (0.305mm)

Standard Sizes
12" x 160"(304mm * 48.76M)

The TlS series can be die-cut into different shapes and provided. lf you need different thicknesses, please contact our company.

Thermal Silicone Insulation Pad For Gpu Cpu Cooling Pad 0.305MM Low Thermal Resistance

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Our services

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


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