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3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

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3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

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Brand Name : Ziitek

Model Number : TIF1120-20-10UF thermal pad

Certification : ISO9001

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Name : 2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads for CPU

Feature : High durability

keyword : Thermal Gap Pad

Continuos Use Temp : -40 to 160℃

Thickness : 3.0mmT

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2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads for CPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

TIF100-20-10UF-Datasheet-REV02.pdf

Ziitek TIF1120-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


<Good thermal conductive: 2.0 W/mK
<Thickness: 3.0mmT
<Hardness:75 Shore 00
<Colour: gray

<Moldability for complex parts
<Soft and compressible for low stress applications
<Naturally tacky needing no further adhesive coating



Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

Typical Properties of TIF1120-20-10UF
Product Name TIF1120-20-10UF Series
Colour Gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.7 g/cc
Thickness 3.0mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 4.6 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 2.0W/mK
Volume Resistivity 1.0*1012 Ohm-cm

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online


Product Tags:

2.0W/MK Heat Dissipation Pad

      

CPU Heat Dissipation Pad

      

2.0W/MK Thermal Pad For Heat Sink

      
Wholesale 3.0mmT 2.0W/MK Heat Dissipation Pad For CPU from china suppliers

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