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4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules

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4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules

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Brand Name : Ziitek

Model Number : TIF1180N-40-10F thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Thickness : 4.5mmT

part number : TIF1180N-40-10F

keyword : thermal gap pad

Dielectric Breakdown Voltage : >5500 VAC

Name : 4.0 W/mK Moldability for Complex Parts Thermal Pad for RDRAM Memory Modules

Application : Telecommunication hardware

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4.0 W/mK Moldability for Complex Parts Thermal Pad for RDRAM Memory Modules

Company Profile

With professional R&D capabilities and over 17 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

TIF100N-40-10F-Specification-sheet.pdf

Ziitek TIF1180N-40-10F​ thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.


<Good thermal conductive: 4.0 W/mK
<Thickness: 4.5mmT
<Hardness:55±5 Shore 00
<Colour: gray

<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications

Applications

<cooling components to the chassis of frame

<High speed mass storage drives

<Heat Sinking Housing at LED-lit BLU in LCD

<LED TV and LED-lit lamps

<RDRAM memory modules

<Micro heat pipe thermal solutions

Typical Properties of TIF1180N-40-10F
Product Name TIF1180N-40-10F Series
Colour Gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity

2.1 g/cm^3

Thickness 4.5mmT
Hardness 55±5 Shore 00
Dielectric constant@1MHz 4.7 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 4.0W/mK
Volume Resistivity 1.0*1012 Ohm-cm


Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules


Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules

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Product Tags:

4.0 W/MK heat sink thermal pad

      

4.5mm heat sink thermal pad

      

RDRAM Memory Modules heat sink pad

      
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