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Dongguan Ziitek Electronical Material and Technology Ltd.
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Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

Dongguan Ziitek Electronical Material and Technology Ltd.
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Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

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Brand Name : Ziitek

Model Number : TIF7120HZ thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Name : Thermal Conductive Silicone Hot Pad For Led Computer Graphics Card Cpu Gpu

Specific gravity : 3.45 g/cm^3

Part number : TIF7120HZ

Hardness : 55±5

Thickness : 3.0mmT

Keyword : Thermal Conductive Gap Filler

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Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

TIF700HZ-Series-Datahseet.pdf

Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

Ziitek TIF7120HZ is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7120HZ is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

< Good thermal conductive: 7.00 W/mK
< Thickness: 3.0mmT
< Hardness: 55±5
< Colour: blue

< Naturally tacky needing no further adhesive coating
< Available in varies thicknesses
< Broad range of hardnesses available

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

Typical Properties of TIF7120HZ
Product Name TIF7120HZ Series
Colour Blue
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity

3.45 g/cc

Thickness 3.0mmT
Hardness 55±5
Dielectric constant@1MHz 4.5 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 7.0W/mK
Flame Rating 94-V0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Wholesale Customized Mobile Phone Thermal Conductive Gap Filler

Our services

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.


Product Tags:

Thermal Conductive Gap Filler

      

Mobile Phone Conductive Gap Filler

      

Mobile Phone Thermal Conductive Gap Filler

      
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