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Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

Name: Hardness 75 Shore 00 25mm Thermal Pad Easy Release Construction For Laptop Mainboard
Brand: Ziitek
Price: 0.1 USD

Wholesale Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard from china suppliers

Brand Name : Ziitek

Model Number : TIF1100-10UF thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Dielectric Breakdown Voltage : >5500 VAC

Name : Hardness 75 Shore 00 Easy Release Construction Thermal Pad for Mainboard

material : silicone

keyword : Thermal Gap Pad

Dielectric constant : 3.9 MHz

Specific gravity : 2.2 g/cc

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Hardness 75 Shore 00 Easy Release Construction Thermal Pad for Mainboard

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

TIF100-10UF-Datasheet-REV02.pdf

Ziitek TIF1100-10UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

<Good thermal conductive:1.5 W/mK

<Thickness: 2.5mmT

<Hardness:75 Shore 00

<Colour: Gray

<Moldability for complex parts
<Outstanding thermal performance
<High tack surface reduces contact resistance

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF1100-10UF
Product Name	TIF1100-10UF Series
Colour	gray
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	2.2 g/cc
Thickness	2.5mmT
Hardness	75 Shore 00
Dielectric constant@1MHz	3.9 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	1.5 W/mK
Volume Resistivity	1.0*10^{12 _Ohm-cm}

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

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